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BM1117
GENERAL DESCRIPTION The BM1117 series of adjustable and fixed voltage regulators are designed to provide 1A output current and to operate down to 1V input-to-output differential. The dropout voltage of the device is guaranteed maximum 1.3V at maximum output current, decreasing at lower load currents. On-chip trimming adjusts the reference voltage to within 1% accuray. Current limit is also trimmed, minimizing the stress under overload conditions on both the regulator and power source circuitry. The BM1117 devices are pin compatible with other three-terminal SCSI regulators and are offered in the low profile surface mount SOT-223 package and in the TO-252 (DPAK) plastic package.
FEATURES
Three Terminal Adjustable or Fixed Voltages* 1.5V, 1.8V, 2.5V, 2.85V, 3.3V and 5.0V Output Current of 1A Operates Down to 1V Dropout Line Regulation: 0.2% Max. Load Regulation: 0.4% Max. SOT-223 and TO-252 package available
APPLICATIONS
High Efficiency Linear Regulators Post Regulators for Switching Supplies 5V to 3.3V Linear Regulator Power Management for Notebook Battery Chargers Battery Powered Instrumentation Active SCSI Terminators
ORDERING INFORMATION
PACKAGE TYPE OPERATING JUNCTION TEMPERATURE RANGE
0 to 125 C 0 to 125 C 0 to 125 C 0 to 125 C 0 to 125 C 0 to 125 C 0 to 125 C
TO-252
BM1117-ADJ BM1117-1.5 BM1117-1.8 BM1117-2.5 BM1117-2.85 BM1117-3.3 BM1117--5.0
SOT-223
BM1117-ADJ BM1117-1.5 BM1117-1.8 BM1117-2.5 BM1117-2.85 BM1117-3.3 BM1117-5.0
*For additional available fixed voltages contact factory.
PIN DESCRIPTIONS
FIXED VERSION 1- Ground 2- VOUT 3- VIN ADJUSTABLE VERSION 1- Adjust 2- VOUT 3- VIN SOT-223 Top View
TO-252 FRONT VIEW
3 2 1
TAB IS OUTPUT
1 2 3
BOOKLY MICRO ELECTRONIC LIMITED CORP.
SPECIFICATION ABSOLUT MAXIMUM RATINGS(Note 1)
Power Dissipation Input Voltage Operating Junction Temperature Control Section Power Transistor Storage temperature 0C to 125CS 0C to 150C - 65C to +150C Internally limited 22V Soldering information Lead Temperature (10 sec) Thermal Resistance TO-252 package SOT-223 package
BM1117
300C JA= 80C/W JA= 90C/W*
* With package soldering to copper area over backside ground plane or internal power plane JA can vary from 46C/W to >90C/W depending on mounting technique and the size of the copper area.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics at IOUT = 0 mA, and TJ = +25C unless otherwise specified. Parameter
Reference Voltage (Note 2) Output Voltage (Note 2)
Device
BM1117
Conditions
IOUT = 10 mA 10mA IOUT 1A, 1.5V (VIN - VOUT) 12V
Min
1.238 1.225 1.485
Typ
1.250 1.250 1.500 1.500 1.800 1.800 2.500 2.500 2.850 2.850 3.300 3.300 5.000 5.000 0.015 0.035 0.3 0.6 0.3 0.6 0.3 0.6 0.3 0.6 0.5 1.0 0.5 1.0
Max
1.262 1.270 1.515 1.524 1.818 1.827 2.525 2.560 2.88 2.91 3.333 3.365 5.050 5.100 0.2 0.2 5 6 5 6 6 6 6 6 10 10 10 10
Units
V V V V V V V V V V V V V V % % mV mV mV mV mV mV mV mV mV mV mV mV
BM1117-1.5 BM1117-1.8 BM1117-2.5 BM1117-2.85 BM1117-3.3 BM1117-5.0
0IOUT 1A ,3.0VVIN 12V 0 IOUT 1A , 3.3VVIN 12V 0 IOUT1A ,4.0VVIN 12V 0 IOUT 1A ,4.35VVIN 12V 0 IOUT 1A ,4.75V VIN 12V 0 IOUT 1A , 6.5V VIN 12V IOUT = 10 mA , 1.5V (VIN - VOUT) 12V 3.0VVIN 12V 3.3VVIN 12V 4.0VVIN 12V 4.35VVIN 12V 4.75VVIN 12V 6.5VVIN 12V
1.476 1.782 1.773 2.475 2.460 2.82 2.79 3.267 3.235 4.950 4.900
Line Regulation
BM1117 BM1117-1.5 BM1117-1.8 BM1117-2.5 BM1117-2.85 BM1117-3.3 BM1117-5.0
BOOKLY MICRO ELECTRONICS LIMITED CORP.
SPECIFICATION
Parameter
Load Regulation (Notes 2, 3)
BM1117
Conditions
(VIN - VOUT) =3V, 10mAIOUT 1A VIN=5V, 0IOUT 1A VIN=5V, 0IOUT1A VIN=5V, 0IOUT 1A VIN=5V, 0 IOUT1A VIN=5V, 0 IOUT1A VIN=8V, 0IOUT 1A VOUT , VREF = 1%, IOUT = 1A (Note 4) 1.1 1.3 V
Device
BM1117 BM1117-1.5 BM1117-1.8 BM1117-2.5 BM1117-2.85 BM1117-3.3 BM1117-5.0
Min
Typ
0.1 0.2 3 6 3 6 3 6 3 6 3 7 5 10
Max
0.3 0.4 10 20 10 20 12 20 12 20 15 25 20 35
Units
% mV mV mV mV mV mV mV mV mV mV mV mV
Dropout Voltage (VIN - VOUT)
BM1117 /-1.5/-1.8/-2.5/-2. 85/-3.3/-5.0 BM1117
Current Limit
/-1.5/-1.8/-2.5/-2. 85/-3.3/-5.0
(VIN - VOUT) = 5V
900
1,100
1,500
mA
Minimum Current
Load
BM1117 BM1117
(VIN - VOUT) = 12V (Note 5) VIN 12V f =120Hz , COUT = 22F
5
10
mA
Quiescent Current
/-1.5/-1.8/-2.5/-2. 85/-3.3/-5.0
5
10
mA
Ripple Rejection
BM1117
Tantalum, IOUT = 1A, (VIN-VOUT ) = 3V, CADJ =10F
60
75
dB
BM1117-1.5/-1.8/ f =120Hz , COUT = 22F -2.5/- 2.85 BM1117-3.3 BM1117-5.0 Thermal Regulation BM1117 Adjust Pin Current Adjust Pin Current Change Temperature Stability BM1117 BM1117 Tantalum, IOUT = 1A, VIN = 6V f =120Hz , COUT = 22F Tantalum, IOUT= 1A, VIN = 6.3V f =120Hz , COUT = 22F Tantalum, IOUT = 1A, VIN = 8V TA = 25C, 30ms pulse 10mA IOUT 1A, 1.5V (VIN - VOUT) 12V 10mA IOUT 1A, 1.5V (VIN- VOUT) 12V
60 60 60
72 72 68 0.008 55 120 0.2 0.5 5 0.04
dB dB dB %W A A A %
BOOKLY MICRO ELECTRONICS LIMITED CORP.
SPECIFICATION
Parameter
Long Term Stability RMS Output Noise (% of VOUT ) Thermal Resistance Junction-to-Case Parameters identified with boldface type apply over the full operating temperature range.
BM1117
Conditions
TA =125C, 1000Hrs TA=25C, 10Hz f 10kHz
Device
Min
Typ
0.3 0.003
Max
1
Units
% %
15
C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Note 2: Line and Load regulation are guaranteed up to the maximum power dissipation of 1.2 W. Power dissipation is determined by the input/output differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range. Note 3: See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction temperature by low duty cycle pulse testing. Load regulation is measured at the output lead ~1/8" from the package. Note 4: Dropout voltage is specified over the full output current range of the device.
Note 5: Minimum load current is defined as the minimum output current required to maintain regulation. When 1.5V (VIN - VOUT) 12V the device is guaranteed to regulate if the output current is greater than 10mA.
APPLICATION HINTS
The BM1117 series of adjustable and fixed regulators are easy to use and are protected against short circuit and thermal overloads. Thermal protection circuitry will shut-down the regulator should the junction temperature exceed 165C at the sense point. Pin compatible with older three terminal adjustable regulators, these devices offer the advantage of a lower dropout voltage, more precise reference tolerance and improved reference stability with temperature.
Stability
The circuit design used in the BM1117 series requires the use of an output capacitor as part of the device frequency compensation. The addition of 22F solid tantalum on the output will ensure stability for all operating conditions. When the adjustment terminal is bypassed with a capacitor to improve the ripple rejection, the requirement for an output capacitor increases. The value of 22F tantalum covers all cases of bypassing the adjustment terminal. Without bypassing the adjustment terminal smaller capacitors can be used with equally good results. To ensure good transient response with heavy load current changes capacitor values on the order of 100mF are used in the output of many regulators. To further improve stability and transient response of these devices larger values of output capacitor can be used.
Protection Diodes
Unlike older regulators, the BM1117 family does not need any protection diodes between the adjustment pin and the output and from the output to the input to prevent over-stressing the die. Internal resistors are limiting the internal
BOOKLY MICRO ELECTRONICS LIMITED CORP.
SPECIFICATION
.current paths on the BM1117 adjustment pin, therefore even with capacitors on the adjustment pin no protection diode is needed to ensure device safety under short-circuit conditions. Diodes between the input and output are not usually needed. Microsecond surge currents of 50A to 100A can be handled by the internal diode between the input and output pins of the device. In normal operations it is difficult to get those values of surge currents even with the use of large output capacitances. If high value output capacitors are used, such as 1000mF to 5000mF and the input pin is instantaneously shorted to ground,
BM1117
damage can occur. A diode from output to input is recommended, when a crowbar circuit at the input of the BM1117 is used (Figure 1).
Output Voltage
The BM1117 series develops a 1.25V reference voltage between the output and the adjust terminal. Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage. This current is normally the specified minimum load current of 10mA. Because IADJ is very small and constant it represents a small error and it can usually be ignored
VIN
BM1117 IN OUT ADJ
VIN
VOUT R1 COUT
22uF
IN
BM1117 OUT ADJ
VOUT
VREF
R1
IADJ
50uA
R2
CADJ
10uF
R2
VOUT = VRE F (1+ R2/R1)+IADJR2
Figure 1.
Figure 2. Basic Adjustable Regulator effective resistance between the regulator and the load would be: RP x ((R2+R1)/ R1), RP = Parasitic Line Resistance
VIN
BM1117 OUT ADJ
Load Regulation
True remote load sensing it is not possible to provide, because the BM1117 is a three terminal device. The resistance of the wire connecting the regulator to the load will limit the load regulation. The data sheet specification for load regulation is measured at the bottom of the package. Negative side sensing is a true Kelvin connection, with the bottom of the output divider returned to the negative side of the load. The best load regulation is obtained when the top of the resistor divider R1 is connected directly to the case not to the load. If R1 were connected to the load, the
IN
Rp
R1*
RL
R2*
*CONNECT R1 TO CASE *CONNECT R2 TO LOAD
Figure 3. Connections for Best Load Regulation
BOOKLY MICRO ELECTRONICS LIMITED CORP.
SPECIFICATION
Connected as shown above , RP is not multiplied by the divider ratio In the case of fixed voltage devices the top of R1 is connected Kelvin internally, and the ground pin can be used for negative side sensing.
BM1117
Experiments have shown that the heat spreading copper layer does not need to be electrically connected to the tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the pad of the device, and a ground plane layer either inside or on the opposite side of the board. Although the actual thermal resistance of the PC material is high, the Length/Area ratio of the thermal resistance between layers is small. The data in Table 1, was taken using1/16" FR-4 board with 1 oz. copper foil, and it can be used as a rough guideline for estimating thermal resistance. For each application the thermal resistance will be affected by thermal interactions with other components on the board. To determine the actual value some experimentation will be necessary. The power dissipation of the BM1117 is equal to: PD = ( VIN - VOUT )( IOUT ) Maximum junction temperature will be equal to: TJ = TA(MAX) + PD PD :Thermal esistance (junction-to-ambient) Maximum junction temperature must not exceed 125C.
Thermal Considerations
The BM1117 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings of 125C should not be exceeded under continuous normal load conditions. Careful consideration must be given to all sources of thermal resistance from junction to ambient. For the surface mount package SOT-223 additional heat sources mounted near the device must be considered. The heat dissipation capability of the PC board and its copper traces is used as a heat sink for the device. The thermal resistance from the junction to the tab for the BM1117 is 15C/W. Thermal resistance from tab to ambient can be as low as 30C/W. The total thermal resistance from junction to ambient can be as low as 45C/W. This requires a reasonable sized PC board with at least on layer of copper to spread the heat across the board and couple it into the surrounding air.
Table 1.
COPPER AREA TOP SIDE*
2500 Sq. mm 1000 Sq. mm 225 Sq. mm 100 Sq. mm 1000 Sq. mm 1000 Sq. mm
BACK SIDE
2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 1000 Sq. mm 0
BOARD AREA
2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 1000 Sq. mm 1000 Sq. mm
THERMAL RESISTANCE (JUNCTION-TO-AMBIENT)
45C/W 45C/W 53C/W 59C/W 52C/W 55C/W
BOOKLY MICRO ELECTRONICS LIMITED CORP.
SPECIFICATION
Ripple Rejection
BM1117
The ripple rejection values are measured with the adjustment pin bypassed. The impedance of the adjust pin capacitor at the ripple frequency should be less than the value of R1 (normally 100to 200) for a proper bypassing and ripple rejection approaching the values shown. The size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100 at 120Hz the adjust pin capacitor should be >13mF. At 10kHz only 0.16mF is needed. The ripple rejection will be a function of output voltage, in circuits without an adjust pin bypass capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference voltage (VOUT / VREF ).
BOOKLY MICRO ELECTRONICS LIMITED CORP.
SPECIFICATION TYPICAL CHARACTERISTICS
Minimum Operating Current (Adjustable Device)
BM1117
Short-Circuit Current
Load Regulation
Ripple Rejection vs. Current
Temperature Stability
Adjust Pin Current
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SPECIFICATION PACKAGE DIMENSIONS
Inches (millimeters) unless otherwise noted. TO-252 PLASTIC PACKAGE (D)
BM1117
3 LEAD SOT-223 PLASTIC PACKAGE
Note: Bookly Micro assumes no responsibility for any errors which may appear in this document. reserves the right to change devices or specifications detailed herein at any time without notice.
BOOKLY MICRO ELECTRONICS LIMITED CORP.

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